| Recommended semester: 3rd semester |
| Scope and form: Project work with supporting lectures. |
| Evaluation: Approval of exercises and reports
|
| Examination: Pass/fail |
| Prerequisites: 31024 |
| Participant limitation: Max. 16 |
Aim: The aim of the course is to enable the student to
- Design an electronic system using hybrid thickfilm.
- Design passive components on thickfilm
- Get an overview on the currently used packaging and interconnection technologies.
- Get an overview of the thermal problems caused by high component density and how they can be solved using thickfilm. |
Contents: Thick Film technology (high temperature -as well as polymer).
-Electrical properties of thickfilm circuits and the passive components on thickfilm
-Interconnection technologies, Chip Scale Packaging, Ball Grid Array, Wirebonding, Flip Chip.
-Packaging technology (Hermetical non hermetical), Chip On Board, die bonding.
-Thermal considerations in microelectronic / thickfilm circuits.
Thinfilm.
ASIC's. |
| Contact: Claus Kjærgaard, building 349, (+45) 4525 5266, ck@oersted.dtu.dk |
| Department: 031 Ørsted DTU |
| Keywords: Thickfilm, Hybrid, Microelectronic, Packaging Technology |
| Updated: 08-05-2001 |
